Note: For now, we only accept orders within Philippines.


Features:
  • Transaction Layer, Data Link Layer and Firmware (BIOS/EFI) tests for PCI Express 2.0 and 1.x
  • MidBusconnector for analyzer debugging
  • Teledyne LeCroy connector for Summit™ T2-16 Protocol Analyzer
  • Field-upgradeable FPGA
  • USB 2.0 connector for topology simulation model
  • x16 Connector for testing add-in cards from x1 to x16 lane widths
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